TGA2513 データシートの表示（PDF） - TriQuint Semiconductor

部品番号

コンポーネント説明

メーカー

TGA2513

Wideband LNA

TriQuint Semiconductor 

Mechanical Characteristics

TGA2513

1.351 (0.053)

1.242 (0.049)

2

1.210 (0.048)

3

0.973 (0.038)

4

0.235 (0.009)

1

0.000 (0.000)

0.099 (0.004)

5

Units: millimeters (inches)

Thickness: 0.100 (0.004) (reference only)

Chip edge to bond pad dimensions are shown to center of pad

Chip size tolerance: +/- 0.051 (0.002)

GND IS BACKSIDE OF MMIC

Bond Pad #1:

Bond Pad #2:

Bond Pad #3:

Bond Pad #4:

Bond Pad #5:

RF IN

VG2

VD

RF OUT

VG1

0.100 x 0.125 (0.004 x 0.005)

0.100 x 0.100 (0.004 x 0.004)

0.100 x 0.125 (0.004 x 0.005)

0.100 x 0.125 (0.004 x 0.005)

0.100 x 0.100 (0.004 x 0.004)

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

8

TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com

May 2009 © Rev -

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