TGA2513-SM データシートの表示（PDF） - TriQuint Semiconductor
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TGA2513-SM Datasheet PDF : 12 Pages
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Advance Product Information
July 26, 2007
TGA2513-SM
Evaluation Board Layout Details
Via holes in the four corners
of the package are required
to ensure stable operation.
These vias need to be
connected to ground paddle
Maximum density of via holes
under ground paddle for
optimum electrical and thermal
performance
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