TGA4506(2005) データシートの表示（PDF） - TriQuint Semiconductor
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TGA4506 Datasheet PDF : 9 Pages
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Advance Product Information
July 19, 2005
TGA4506
Chip Assembly Diagram
Vg
RF In
RF Out
Vd
All three Vd pads (pad # 9, 10, 11 from mechanical drawing)
do not need to be connected
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
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TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
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