TGA4522(2005) データシートの表示（PDF） - TriQuint Semiconductor
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TGA4522 Datasheet PDF : 11 Pages
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Advance Product Information
September 21, 2005
TGA4522
Recommended Chip Assembly Diagram
Vg
15
1.0 F
0.01 F
100pF
100pF
100pF
0.01 F
Vd
15
1.0 F
TFN (10mil Alumina)
TFN (10mil Alumina)
Wedge bonds or ribbons
Vg
15
1.0 F
0.01 F
100pF
100pF
100pF
0.01 F
Vd
15
1.0 F
To reduce these components (0.01 F, 15 , 1.0 F) connect:
Vg @ bottom to Vg @ top
Vd @ bottom to Vd @ top
Bias Conditions: Vd = 6 V
Vg = ~ -0.6 V to get 400mA Id
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
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