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TK65015MBX データシートの表示(PDF) - Toko America Inc

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TK65015MBX Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
TK65015
TYPICAL PERFORMANCE CHARACTERISTICS
OSCILLATOR FREQUENCY vs.
TEMPERATURE
IO = 1 mA
92
90
88
VIN = 0.9 V
86
84
VIN = 1.3 V
82
80
VIN = 1.6 V
78
-20
0
20 40 60
TEMPERATURE (°C)
1.5 2.0 2.5 3.0
80 OU10T0 PUT CURRENT (mA)
1
3.5 42.00 40 60
TEM2 PERATURE (°C)
80
100
32
20 40 60 80 100
TEMPERATURE (°C)
4
MAXIMUM OUTPUT CURRENT vs.
INDUCTOR VALUE (µH)
16
VOUT = 2.7 V
14
TA = 25 °C
12
VIN = 1.3 V
10
8
6
4
2 VIN = 0.9 V
0
0 80 160 240 320 400 440
INDUCTOR VALUE (µH)
7
February, 1996 TOKO, Inc.
OUTPUT VOLTAGE vs. TEMPERATURE
3.045
IO = 1 mA
3.035
3.025
3.015
3.005
2.995
2.985
VIN = 1.6 V
VIN = 1.3 V
2.975
2.965
2.955
-20
VIN = 0.9 V
0 20 40 60 80 100
TEMPERATURE (°C)
5
EFFICIENCY vs. INDUCTOR VALUE (µH)
AT MAXIMUM OUTPUT CURRENT
88
VIN = 1.3 V
84
80
76
VIN = 0.9 V
72
VOUT = 2.7 V
68
TA = 25 °C
64
60
56
52
0 80 160 240 320 400 440
INDUCTOR VALUE (µH)
6
Handling Molded Resin Packages
All plastic molded packages absorb some moisture from the air. If
moisture absorption occurs prior to soldering the device into the printed
circuit board, increased separation of the lead from the plastic molding
may occur, degrading the moisture barrier characteristics of the device.
This property of plastic molding compounds should not be overlooked,
paticularly in the case of very small packages, where the plastic is very
thin.
In order to preserve the original moisture barrier properties of the package,
devices are stored and shipped in moisture proof bags, filled with dry air.
The bags should not be opened or damaged prior to the actual use of the
devices. Once opened the devices should be stored in a low relative
humidity environment (40 to 65%) or in an enclosed environment with
desicant.
2-2-96
Page 3

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