TLP2066(TPRF) データシートの表示（PDF） - Toshiba

部品番号

コンポーネント説明

メーカー

TLP2066(TPRF)

TOSHIBA PHOTOCOUPLER GaAℓAs IRED & PHOTO-IC

Toshiba 

Soldering and Storage

TLP2066

1. Soldering

1.1 Soldering

When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as

much as possible by observing the following conditions.

1) Using solder reflow

·Temperature profile example of lead (Pb) solder

(°C)

240

210

160

140

This profile is based on the device’s maximum

heat resistance guaranteed value.

Set the preheat temperature/heating

temperature to the optimum temperature

corresponding to the solder paste type used

by the customer within the described profile.

60 to 120s

less than 30s

Time

(s)

·Temperature profile example of using lead (Pb)-free solder

(°C)

260

This profile is based on the device’s

maximum heat resistance guaranteed value.

230

Set the preheat temperature/heating

temperature to the optimum temperature

corresponding to the solder paste type used

190

by the customer within the described profile.

180

60 to 120s

30 to 50s

Time

(s)

Reflow soldering must be performed once or twice.

The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)

・Please preheat it at 150°C between 60 and 120 seconds.

・Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.

3) Using a soldering iron

Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may be heated

at most once.

8

2014-09-01

Share Link: