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TLP554(2002) データシートの表示(PDF) - Toshiba

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TLP554 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
RECOMMENDED OPERATING CONDITIONS
CHARACTERISTIC
SYMBOL MIN.
Low Level input Voltage
High Level input current
Supply Voltage
VFL
-3
IFH
6.3*
VCC
4.5
High-Level Enable Voltage
Low-Level Enable Voltage
VEH
2.0
VEL
0
Fan Out(TTL Load)
N
¾
Operating Temperature
Topr
0
*6.3mA condition permits at least 20% CTR degradation
Initial switching threshold is 5.0mA or less.
TYP.
0
¾
5
¾
¾
¾
¾
MAX.
1.0
20
5.5
VCC
0.8
8
70
UNIT
V
mA
V
V
V
¾
°C
MAXIMUM RATINGS (Ta = 25°C)
CHARACTERISTIC
Forward Current
Reverse Voltage
Output Current
Output Voltage
Supply Voltage
Enable Voltage
Output Power Dissipation
Storage Temperature Range
Operating Temperature Range
Lead Soldering Temperature (10 s)
Isolation Voltage (AC, 1 minute, R.H.60%)
SYMBOL
(Note 2)
(Note 3)
(Note 4)
(Note 5)
IF
VR
IO
VO
VCC
VE
PO
Tstg
Topr
Tsol
BVS
RATING
20
5
25
-0.5~7
7
5.5
40
-55~125
-40~85
260
2500
UNIT
mA
V
mA
V
V
V
mW
°C
°C
°C
Vrms
(Note 1) The VCC supply voltage to each TLP554 isolator must be bypassed by a 0.1mF
capacitor or larger.This can be either a ceramic or solid tantalum capacitor with
good high frequency characteristic and should be connected as close as possible to
the package VCC and GND pins each device.
(Note 2) 1 Minute Maximum.
(Note 3) Not to exceed VCC by more than 500mV.
(Note 4) 2mm below seating plane.
(Note 5) Device considered a two-terminal device :Pins 1,2,3 and 4 shorted together,and Pins 5,
6,7 and 8 shorted together.
TLP554
2
2002-07-09

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