TMP47C101MG データシートの表示（PDF） - Toshiba

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TMP47C101MG

Original CMOS 4-Bit Microcontroller

Toshiba 

TMP47C101/201

1. Part number

2. Package code and dimensions

Previous Part Number Previous Package Code

(in Body Text)

(in Body Text)

New Part Number

New Package Code

OTP

TMP47C101P

P-DIP16-300-2.54A

TMP47C101PG

DIP16-P-300-2.54A

TMP47P201VPG

TMP47C101M

P-SOP16-300-1.27

TMP47C101MG

SOP16-P-300-1.27

—

TMP47C201P

P-DIP16-300-2.54A

TMP47C201PG

DIP16-P-300-2.54A

TMP47P201VPG

TMP47C201M

P-SOP16-300-1.27

TMP47C201MG

SOP16-P-300-1.27

—

*: For the dimensions of the new package, see the attached Package Dimensions diagram.

3. Addition of notes on lead solderability

The following solderability test is conducted on the new device.

Lead solderability of Pb-free devices (with the G suffix)

Test

Solderability

Test Conditions

(1) Use of Lead (Pb)

·solder bath temperature = 230°C

·dipping time = 5 seconds

·the number of times = once

·use of R-type flux

(2) Use of Lead (Pb)-Free

·solder bath temperature = 245°C

·dipping time = 5 seconds

·the number of times = once

·use of R-type flux

Remark

Leads with over 95% solder coverage

till lead forming are acceptable.

II

2008-03-06

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