TMP47P202VMG データシートの表示（PDF） - Toshiba
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TMP47P202VMG Datasheet PDF : 42 Pages
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TMP47C102/202
1. Part number
2. Package code and dimensions
Previous Part Number Previous Package Code
(in Body Text)
(in Body Text)
New Part Number
New Package Code
OTP
TMP47C102P
P-DIP20-300-2.54A
TMP47C102PG
DIP20-P-300-2.54A
TMP47P202VPG
TMP47C102M
P-SOP20-300-1.27
TMP47C102MG
SOP20-P-300-1.27
TMP47P202VMG
TMP47C202P
P-DIP20-300-2.54A
TMP47C202PG
DIP20-P-300-2.54A
TMP47P202VPG
TMP47C202M
P-SOP20-300-1.27
TMP47C202MG
SOP20-P-300-1.27
TMP47P202VMG
*: For the dimensions of the new package, see the attached Package Dimensions diagram.
3. Addition of notes on lead solderability
The following solderability test is conducted on the new device.
Lead solderability of Pb-free devices (with the G suffix)
Test
Solderability
Test Conditions
(1) Use of Lead (Pb)
·solder bath temperature = 230°C
·dipping time = 5 seconds
·the number of times = once
·use of R-type flux
(2) Use of Lead (Pb)-Free
·solder bath temperature = 245°C
·dipping time = 5 seconds
·the number of times = once
·use of R-type flux
Remark
Leads with over 95% solder coverage
till lead forming are acceptable.
II
2008-03-06
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