2559
Protected Quad Power Driver
Thermal Characteristics
Characteristic
Symbol
Test Conditions*
Package B, 2-layer PCB with 0.5 in.2 exposed copper each side
Package Thermal Resistance
RθJA
Package EB, 1-layer PCB with copper limited to solder pads
Package LB, 1-layer PCB with copper limited to solder pads
*Additional thermal information available on the Allegro website
Value Units
43 ºC/W
36 ºC/W
90 ºC/W
PD = (VOUT1 x IOUT1 x dc) + … + (VOUTn x IOUTn x dc)
+ (VCC x ICC) = (TJ - TA)/RJA
Allegro MicroSystems, Inc.
4
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Copyright © 1995, 2002 Allegro MicroSystems, Inc.