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UPB1510GV-E1 データシートの表示(PDF) - NEC => Renesas Technology

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UPB1510GV-E1
NEC
NEC => Renesas Technology NEC
UPB1510GV-E1 Datasheet PDF : 12 Pages
First Prev 11 12
µ PB1510GV
NOTE CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation).
(3) Keep the wiring length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.g. 1 000 pF) to the VCC pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Soldering Conditions
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limitNote: None
Package peak temperature: 215 °C or below
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limitNote: None
Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limitNote: None
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limitNote: None
Recommended Condition Symbol
IR35-00-3
VP15-00-3
WS60-00-1
Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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