UPC2918 データシートの表示（PDF） - NEC => Renesas Technology
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UPC2918 Datasheet PDF : 12 Pages
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µPC2918, 2925, 2926
# RECOMMENDED SOLDERING CONDITIONS
The µPC2918, 2925 and 2926 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact our sales representative.
Type of Surface Mount Device
µPC2918T, µPC2925T, µPC2926T: MP-3Z(SC-63)
Process
Infrared Ray Reflow
Vapor Phase Soldering
Wave Soldering
Partial Heating Method
Conditions
Peak temperature: 235°C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflow processes: 3 times or less.
Peak temperature: 215°C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflow processes: 3 times or less.
Solder temperature: 260°C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120°C or below (Package surface temperature).
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each side of the device).
Symbol
IR35-00-3
VP15-00-3
WS60-00-1
–
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.
Type of Through-hole Device
µPC2918HB, µPC2925HB, µPC2926HB: MP-3(SC-64)
Process
Wave Soldering
(only to leads)
Partial Heating Method
Solder temperature: 260°C or below,
Flow time: 10 seconds or less
Conditions
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each pin).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
10
Data Sheet G14983EJ3V0DS
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