UPC317H データシートの表示（PDF） - NEC => Renesas Technology

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UPC317H

3-TERMINAL POSITIVE ADJUSTABLE REGULATOR

NEC => Renesas Technology 

µPC317

RECOMMENDED SOLDERING CONDITIONS

When soldering these products, it is highly recommended to observe the conditions as shown below. If other

soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult

with our sales offices.

For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL"

(C10535E).

Type of Through-hole Devices

µPC317HF: 3-pin plastic SIP (MP-45G)(isolated TO-220)

Process

Wave soldering (only to leads)

Partial heating method

Conditions

Solder temperature: 260°C or below,

Flow time: 10 seconds or less.

Pin temperature: 300°C or below,

Heat time: 3 seconds or less (per each lead).

Caution For through-hole device, the wave soldering process must be applied only to leads, and make

sure that the package body does not get jet soldered.

REFERENCE DOCUMENTS

QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE MOUNTING THCHNOLOGY MANUAL

SEMICONDUCTORS SELECTION GUIDE – Products and Packages – (CD-ROM)

SEMICONDUCTORS SELECTION GUIDE

NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY CONTROL SYSTEM

-THREE TERMINAL REGULATOR

C11531E

C10535E

X13769X

X10679E

IEI-1212

8

Data Sheet G12826EJ3V0DS00

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