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UPC337HF データシートの表示(PDF) - NEC => Renesas Technology

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UPC337HF
NEC
NEC => Renesas Technology NEC
UPC337HF Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
µPC337
RECOMMENDED SOLDERING CONDITIONS
When soldering these products, it is highly recommended to observe the conditions as shown below. If other
soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult
with our sales offices.
For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL"
(C10535E).
Type of Through-hole Devices
µPC337HF: 3-pin plastic SIP (MP-45G)
Process
Wave soldering
(only to leads)
Partial heating method
Conditions
Solder temperature: 260 °C or below,
Flow time: 10 seconds or less.
Pin temperature: 300 °C or below,
Heat time: 3 seconds or less (per each lead).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make
sure that the package body does not get jet soldered.
REFERENCE DOCUMENTS
QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL
NEC IC PACKAGE MANUAL (CD-ROM)
GUIDE TO QUALITY ASSURANCE FOR SEMICONDUCTOR DEVICES
SEMICONDUCTORS SELECTION GUIDE
NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY CONTROL SYSTEM
–THREE TERMINAL REGULATOR
C11531E
C10535E
C13388E
MEI-1202
X10679E
IEI-1212
7

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