UPC4084C データシートの表示（PDF） - NEC => Renesas Technology
部品番号
コンポーネント説明
メーカー
UPC4084C Datasheet PDF : 8 Pages
| |||
µPC4084
5 RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales
offices.
For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL"(C10535E).
Type of Through-hole Device
µPC4084C: 14-pin plastic DIP (7.62 mm (300))
Process
Wave Soldering
(only to leads)
Partial Heating Method
Conditions
Solder temperature: 260°C or below,
Flow time: 10 seconds or less.
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (per each lead).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that
the package body does not get jet soldered.
Data Sheet G15377EJ3V0DS
7
Share Link: 