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VSC8201DL データシートの表示(PDF) - Vitesse Semiconductor

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VSC8201DL Datasheet PDF : 21 Pages
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VSC8201DL
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Note:Place vias close to or under neath the capacitor pads for
low inductive path and higher heat dissipation rate.
0.1 uF
Figure 2: Local High-Frequency decoupling Capacitor Layout - LBGA package
In addition, a ferrite bead should be used to isolate each analog supply from the rest of the board. The bead should be placed in series
between the bulk decoupling capacitors and the local decoupling capacitors.
Figure 3: Power Supply Decoupling Schematic
The beads should be chosen to have the following characteristics:
• Current Rating of at least 150% of the maximum current of the power supply.
• Impedance of 80 to 100W at 100Mhz.
Recommended beads are:
• Panasonic EXCELSA39 or similar.
• Steward HI 1206N101R-00 or similar.
Rev. 1.6.3 - 9/29/04
VITESSE - CONFIDENTIAL & PROPRIETARY - DO NOT COPY WITHOUT PERMISSION
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