W25X10L データシートの表示（PDF） - Winbond

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W25X10L

1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

Winbond 

W25X10L, W25X20L, W25X40L, W25X80L

9.2.6 Write Status Register (01h) ............................................................................................18

9.2.7 Read Data (03h) .............................................................................................................19

9.2.8 Fast Read (0Bh) .............................................................................................................20

9.2.9 Fast Read Dual Output (3Bh) .........................................................................................21

9.2.10 Page Program (02h) .....................................................................................................22

9.2.11 Sector Erase (20h) .......................................................................................................23

9.2.12 Block Erase (D8h) ........................................................................................................24

9.2.13 Chip Erase (C7h)..........................................................................................................25

9.2.14 Power-down (B9h) ........................................................................................................26

9.2.15 Release Power-down / Device ID (ABh) .......................................................................27

9.2.16 Read Manufacturer / Device ID (90h) ...........................................................................29

9.2.17 JEDEC ID (9Fh)............................................................................................................30

10. ELECTRICAL CHARACTERISTICS......................................................................................... 31

10.1 Absolute Maximum Ratings .......................................................................................... 31

10.2 Operating Ranges......................................................................................................... 31

10.3 Endurance and Data Retention .................................................................................... 31

10.4 Power-up Timing and Write Inhibit Threshold .............................................................. 32

10.5 DC Electrical Characteristics ........................................................................................ 33

10.6 AC Measurement Conditions........................................................................................ 34

10.7 AC Electrical Characteristics ........................................................................................ 35

10.8 AC Electrical Characteristics (cont’d) ........................................................................... 36

10.9 Serial Output Timing ..................................................................................................... 37

10.10 Input Timing................................................................................................................. 37

10.11 Hold Timing ................................................................................................................. 37

11. PACKAGE SPECIFICATION .................................................................................................... 38

11.1 8-Pin SOIC 150-mil (Package Code SN)...................................................................... 38

11.2 8-Pin SOIC 208-mil (Package Code SS)...................................................................... 39

11.3 8-contact 6x5 WSON (Package Code ZP) ................................................................... 40

11.4 8-contact 6x5 WSON Cont’d. (Package Code ZP)....................................................... 41

12. ORDERING INFORMATION .................................................................................................... 42

13. W25X10/20/40/80V AND W25X10/20/40/80L SPEC. COMPARISON..................................... 44

14. REVISION HISTORY ................................................................................................................ 45

Publication Release Date: February 27, 2008

-3-

Revision I

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