W25Q64CV データシートの表示（PDF） - Winbond

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W25Q64CV

3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

Winbond 

W25Q64CV

7.2.37

7.2.38

7.2.39

Erase Security Registers (44h) ...........................................................................................58

Program Security Registers (42h).......................................................................................59

Read Security Registers (48h)............................................................................................60

8. ELECTRICAL CHARACTERISTICS .............................................................................................. 61

8.1 Absolute Maximum Ratings..................................................Error! Bookmark not defined.

8.2 Operating Ranges .............................................................................................................. 61

8.3 Power-up Timing and Write Inhibit Threshold .................................................................... 62

8.4 DC Electrical Characteristics.............................................................................................. 63

8.5 AC Measurement Conditions ............................................................................................. 64

8.6 AC Electrical Characteristics .............................................................................................. 65

8.7 AC Electrical Characteristics (cont’d) ................................................................................. 66

8.8 Serial Output Timing........................................................................................................... 67

8.9 Serial Input Timing.............................................................................................................. 67

8.10 HOLD Timing...................................................................................................................... 67

8.11 WP Timing .......................................................................................................................... 67

9. PACKAGE SPECIFICATION .......................................................................................................... 68

9.1 8-Pin SOIC 208-mil (Package Code SS) ........................................................................... 68

9.2 8-Pin VSOP 208-mil (Package Code ST) .......................................................................... 69

9.3 8-Pin PDIP 300-mil (Package Code DA)............................................................................ 70

9.4 8-Pad WSON 6x5mm (Package Code ZP) ........................................................................ 71

9.5 8-Pad WSON 8x6mm (Package Code ZE) ........................................................................ 73

9.6 16-Pin SOIC 300-mil (Package Code SF).......................................................................... 74

9.7 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 ball array) ......................................... 75

9.8 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array) ............................................ 76

10. ORDERING INFORMATION .......................................................................................................... 77

10.1 Valid Part Numbers and Top Side Marking ........................................................................ 78

11. REVISION HISTORY...................................................................................................................... 79

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