25Q64DWFIG データシートの表示（PDF） - Winbond
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25Q64DWFIG Datasheet PDF : 82 Pages
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W25Q64DW
3. PIN CONFIGURATION SOIC 208-MIL
Top View
/CS
1
8
DO (IO1)
/WP (IO2)
GND
2
7
3
6
4
5
VCC
/HOLD (IO3)
CLK
DI (IO0)
Figure 1a. W25Q64DW Pin Assignments, 8-pin SOIC 208-mil (Package Code SS)
4. PAD CONFIGURATION WSON 6X5-MM / 8X6-MM
Top View
/CS
18
VCC
DO (IO1)
/WP (IO2)
GND
27
36
45
/HOLD (IO3)
CLK
DI (IO0)
Figure 1b. W25Q64DW Pad Assignments, 8-pad WSON (Package Code ZP & ZE)
5. PIN DESCRIPTION SOIC 208-MIL, WSON 6X5/8X6-MM
PIN NO.
PIN NAME
I/O
FUNCTION
1
/CS
I
Chip Select Input
2
DO (IO1)
I/O
Data Output (Data Input Output 1)*1
3
/WP (IO2)
I/O
Write Protect Input ( Data Input Output 2)*2
4
GND
Ground
5
DI (IO0)
I/O
Data Input (Data Input Output 0)*1
6
CLK
I
Serial Clock Input
7
/HOLD (IO3)
I/O
Hold Input (Data Input Output 3)*2
8
VCC
Power Supply
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI/QPI instructions
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