WM8782 データシートの表示（PDF） - Wolfson Microelectronics plc

部品番号

コンポーネント説明

メーカー

WM8782

24-Bit, 192kHz Stereo ADC

Wolfson Microelectronics plc 

Production Data

WM8782

ABSOLUTE MAXIMUM RATINGS

Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously

operating at or beyond these limits. Device functional operating limits and guaranteed performance specifications are given

under Electrical Characteristics at the test conditions specified.

ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible

to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage

of this device.

Wolfson tests its package types according to IPC/JEDEC J-STD-020B for Moisture Sensitivity to determine acceptable storage

conditions prior to surface mount assembly. These levels are:

MSL1 = unlimited floor life at <30C / 85% Relative Humidity. Not normally stored in moisture barrier bag.

MSL2 = out of bag storage for 1 year at <30C / 60% Relative Humidity. Supplied in moisture barrier bag.

MSL3 = out of bag storage for 168 hours at <30C / 60% Relative Humidity. Supplied in moisture barrier bag.

The Moisture Sensitivity Level is specified in Ordering Information.

CONDITION

Digital supply voltage

Analogue supply voltage

Voltage range digital inputs

Voltage range analogue inputs

Ambient temperature (supplies applied)

Storage temperature

Pb free package body temperature (reflow 10 seconds)

Package body temperature (soldering 2 minutes)

Notes:

1. Analogue and digital grounds must always be within 0.3V of each other.

MIN

-0.3V

-0.3V

DGND -0.3V

AGND -0.3V

-55C

-65C

MAX

+4.5V

+7V

DVDD + 0.3V

AVDD +0.3V

+125C

+150C

+260C

+183C

THERMAL PERFORMANCE

PARAMETER

Thermal resistance – junction to

ambient

SYMBOL

RθJA

TEST CONDITIONS

MIN

TYP

81

See note 1

MAX

UNIT

°C/W

Notes:

1. Figure given for package mounted on 4-layer FR4 according to JESD51-7. (No forced air flow is assumed).

2. Thermal performance figures are estimated.

w

PD, April 2010, Rev 4.7

5

Share Link: