WS1103 データシートの表示（PDF） - Avago Technologies
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WS1103 Datasheet PDF : 15 Pages
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PCB Design Guidelines
The recommended WS1403 PCB land pattern is shown
in Figure 14 and Figure 15. The substrate is coated with
solder mask between the I/O and conductive paddle to
protect the gold pads from short circuit that is caused by
solder bleeding/bridging.
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads.
The recommended stencil layout is shown in Figure 16.
Reducing the stencil opening can potentially generate
more voids. On the other hand, stencil openings larger
than 100% will lead to excessive solder paste smear or
bridging across the I/O pads or conductive paddle to
adjacent I/O pads. Considering the fact that solder paste
thickness will directly affect the quality of the solder
joint, a good choice is to use laser cut stencil composed
of 0.100 mm (4 mils) or 0.127 mm (5 mils) thick stainless
steel which is capable of producing the required fine
stencil outline.
0.6
0.4
0.8
0.25
Figure 14. Metallization
0.7
0.5
0.1
∅ 0.3 mm ON
0.5 mm PITCH
0.55
1.325
0.8
1.4
Figure 15. Solder mask opening
0.6
0.4
0.5
1.05
0.8
1.1
Figure 16. Solder paste stencil aperture
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