XM1005-BD データシートの表示（PDF） - Mimix Broadband

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XM1005-BD

37.0-46.0 GHz GaAs MMIC Balanced Image Reject Mixer

Mimix Broadband 

37.0-46.0 GHz GaAs MMIC

Balanced Image Reject Mixer

February 2007 - Rev 16-Feb-07

Mechanical Drawing

2.100

(0.083)

XM1005-BD

0.879 1.279

(0.035) (0.050)

2

3

M1005-BD

0.693

(0.027)

1

4

1.350

(0.053)

5

0.750

(0.030)

6

0.0

0.0

0.879

1.590

(0.035)

(0.063)

(Note: Engineering designator is 40IRM0540)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.592 mg.

Bond Pad #1 (RF)

Bond Pad #2 (IF1)

Bond Pad #3 (Vg1a)

Bond Pad #4 (LO)

Bond Pad #5 (Vg1b)

Bond Pad #6 (IF2)

Vg1a

Bias ArrangemenIFt1

XM1005-BD

2

3

Bypass Capacitors - See App Note [2]

RF 1

4 LO

5

Vg1b

6

IF2

Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Page 4 of 7

Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

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