XP1009 データシートの表示（PDF） - Mimix Broadband

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XP1009

GaAs MMIC Power Amplifier

Mimix Broadband 

17.0-21.0 GHz GaAs MMIC

Power Amplifier

May 2006 - Rev 10-May-06

Mechanical Drawing

1.280

(0.050)

0.736

1

(0.029)

P1009

2

0.736

(0.029)

0.0

0.0

6

5

4

3

0.785 1.185 1.585

(0.031) (0.047) (0.062)

2.185

(0.086)

3.920

(0.154)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.111 mg.

Bond Pad #1 (RF In)

Bond Pad #2 (RF Out)

Bond Pad #3 (Vd2)

Bond Pad #4 (Vg2)

Bond Pad #5 (Vd1)

Bond Pad #6 (Vg1)

Bias Arrangement

RF In 1

6

5

4

3

10

Vg1

Vd1

10

Vd2

Vg2

2 RF Out

Bypass Capacitors - See App Note [2]

Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Page 4 of 6

Characteristic Data and Specifications are subject to change without notice. ©2006 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

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