ZXM64N03X
ELECTRICAL CHARACTERISTICS (at Tamb = 25°C unless otherwise stated)
PARAMETER
SYMBOL MIN. TYP. MAX. UNIT CONDITIONS
STATIC
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage
Gate-Source Threshold Voltage
Static Drain-Source On-State
Resistance (1)
Forward Transconductance (3)
DYNAMIC (3)
V(BR)DSS
30
IDSS
IGSS
VGS(th)
1.0
RDS(on)
gfs
4.3
V
1 µA
±100 nA
V
0.045 Ω
0.060 Ω
S
ID=-250µA, VGS=0V
VDS=30V, VGS=0V
VGS=± 20V, VDS=0V
I
D
=-25
0
µA
,
VDS=
VGS
VGS=10V, ID=3.7A
VGS=4.5V, ID=1.9A
VDS=10V,ID=-1.9A
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
SWITCHING(2) (3)
Ciss
Coss
Crss
950
pF
200
pF
VDS=25 V, VGS=0V,
f=1MHz
50
pF
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge
Gate-Source Charge
Gate Drain Charge
SOURCE-DRAIN DIODE
td(on)
tr
td(off)
tf
Qg
Qgs
Qgd
4.2
4.5
20.5
8
ns
ns
ns
ns
27 nC
5 nC
4.5 nC
VDD =5V, ID=3.7A
RG=6.2Ω, RD=4.0Ω
(Refer to test circuit)
VDS=24V,VGS=10V,
ID=3.7A
(Refer to test circuit)
Diode Forward Voltage (1)
VSD
Reverse Recovery Time (3)
trr
Reverse Recovery Charge(3)
Qrr
0.95 V
24.5
ns
19.1
nC
Tj=25°C, IS=3.7A,
VGS=0V
Tj=25°C, IF=3.7A,
di/dt= 100A/µs
(1) Measured under pulsed conditions. Width=300µs. Duty cycle ≤2%.
(2) Switching characteristics are independent of operating junction temperature.
(3) For design aid only, not subject to production testing.
ISSUE 1 - OCTOBER 2005
4
SEMICONDUCTORS