MX6SWT-A1-0000-000DA7 データシートの表示（PDF） - Cree, Inc

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MX6SWT-A1-0000-000DA7

Cree® XLamp® MX-6S LEDs

Cree, Inc 

XLamp® MX-6S LED

Reflow Soldering Characteristics

In testing, Cree has found XLamp MX-6S LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general

guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used,

and therefore it is the lamp or luminaire manufacturer’s responsibility to determine applicable soldering requirements.

Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.

TP

TL

Tsmax

Tsmin

25

Ramp-up

tP

tS

Critical Zone

TL to TP

ts

Preheat

Ramp-down

t 25˚C to Peak

Time

Profile Feature

Average Ramp-Up Rate (Tsmax to Tp)

Preheat: Temperature Min (Tsmin)

Preheat: Temperature Max (Tsmax)

Preheat: Time (tsmin to tsmax)

Time Maintained Above: Temperature (TL)

Time Maintained Above: Time (tL)

Peak/Classification Temperature (Tp)

Time Within 5 °C of Actual Peak Temperature (tp)

Ramp-Down Rate

Time 25 °C to Peak Temperature

Lead-Free Solder

1.2 °C/second

120 °C

170 °C

65-150 seconds

217 °C

45-90 seconds

235 - 245 °C

20-40 seconds

1 - 6 °C/second

4 minutes max.

Note: All temperatures refer to the topside of the package, measured on the package body surface.

Copyright © 2010-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of

Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.

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