MX6SWT-A1-0000-000DA7 データシートの表示（PDF） - Cree, Inc
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MX6SWT-A1-0000-000DA7 Datasheet PDF : 13 Pages
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XLamp® MX-6S LED
Notes
Measurements
The luminous flux, radiant power, chromaticity, forward voltage and CRI measurements in this document are binning specifications only
and solely represent product measurements as of the date of shipment. These measurements will change over time based on a number
of factors that are not within Cree’s control and are not intended or provided as operational specifications for the products. Calculated
values are provided for informational purposes only and are not intended or provided as specifications.
Pre‑Release Qualification Testing
Please read the LED Reliability Overview for details of the qualification process Cree applies to ensure long-term reliability for XLamp
LEDs and details of Cree’s pre-release qualification testing for XLamp LEDs.
Lumen Maintenance
Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance.
For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document.
Please read the Long-Term Lumen Maintenance application note for more details on Cree’s lumen maintenance testing and forecasting.
Please read the Thermal Management application note for details on how thermal design, ambient temperature and drive current affect
the LED junction temperature.
Moisture Sensitivity
Cree recommends keeping XLamp MX-6S LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to
soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity.
Once the MBP is opened, XLamp MX-6S LEDs should be handled and stored as MSL 2a per JEDEC J-STD-033, meaning they have limited
exposure time before damage to the LED may occur during the soldering
operation. The table on the right specifies the maximum exposure time
Temp.
Maximum Percent Relative Humidity
30% 40% 50% 60% 70% 80% 90%
in days depending on temperature and humidity conditions. LEDs with 35 ºC
-
-
-
17
1
.5
.5
exposure time longer than the specified maximums must be baked 30 ºC
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-
-
28
1
1
1
according to the baking conditions listed below.
25 ºC
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-
-
-
2
1
1
20 ºC
-
-
-
-
2
1
1
Baking Conditions
It is not necessary to bake all XLamp MX-6S LEDs. Only the LEDs that meet all of the following criteria must be baked:
1. LEDs that have been removed from the original MBP.
2. LEDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above.
3. LEDs that have not been soldered.
LEDs should be baked at 70 ºC for 24 hours. LEDs may be baked on the original reels. Remove LEDs from the MBP before baking. Do
not bake parts at temperatures higher than 70 ºC. This baking operation resets the exposure time as defined in the Moisture Sensitivity
section above.
Copyright © 2010-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
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