BAS116H データシートの表示（PDF） - NXP Semiconductors.
部品番号
コンポーネント説明
メーカー
BAS116H Datasheet PDF : 10 Pages
| |||
Nexperia
11. Soldering
BAS116H
Low leakage switching diode
Footprint information for reflow soldering of plastic surface-mounted, 2 leads package
SOD123F
4.4
2.9
2.8
2.1 1.6
1.1
(2×)
1.2
(2×)
solder land
solder paste deposit
occupied area
solder land plus solder paste
solder resist
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Fig 7. Reflow soldering footprint SOD123F
1.1 1.2
(2×) (2×)
sod123f_fr
BAS116H
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 31 May 2011
© Nexperia B.V. 2017. All rights reserved
6 of 10
Share Link: 