FAN3224 データシートの表示（PDF） - Fairchild Semiconductor

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FAN3224

Dual 4-A High-Speed, Low-Side Gate Drivers

Fairchild Semiconductor 

Package Outlines

Figure 2. 3x3 mm MLP-8 (Top View)

Figure 3. SOIC-8 (Top View)

Thermal Characteristics(2)

Package

JL(3) JT(4) JA(5) JB(6) JT(7) Units

8-Lead 3x3 mm Molded Leadless Package (MLP)

1.2

64

42

2.8

0.7

°C/W

8-Pin Small Outline Integrated Circuit (SOIC)

38

29

87

41

2.3

°C/W

Notes:

2. Estimates derived from thermal simulation; actual values depend on the application.

3. Theta_JL (JL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any

thermal pad) that are typically soldered to a PCB.

4. Theta_JT (JT): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is

held at a uniform temperature by a top-side heatsink.

5. Theta_JA (ΘJA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow.

The value given is for natural convection with no heatsink using a 2S2P board, as specified in JEDEC standards JESD51-2,

JESD51-5, and JESD51-7, as appropriate.

6. Psi_JB (JB): Thermal characterization parameter providing correlation between semiconductor junction temperature and an

application circuit board reference point for the thermal environment defined in Note 5. For the MLP-8 package, the board

reference is defined as the PCB copper connected to the thermal pad and protruding from either end of the package. For the

SOIC-8 package, the board reference is defined as the PCB copper adjacent to pin 6.

7. Psi_JT (JT): Thermal characterization parameter providing correlation between the semiconductor junction temperature and

the center of the top of the package for the thermal environment defined in Note 5.

© 2007 Fairchild Semiconductor Corporation

FAN3223 / FAN3224 / FAN3225 • Rev. 1.1.4

3

www.fairchildsemi.com

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