UXE04140F1001TR200 データシートの表示（PDF） - Vishay Semiconductors
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UXE04140F1001TR200 Datasheet PDF : 9 Pages
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TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with the
following specifications:
• EN 60115-1, Generic specification (includes tests)
The Test Procedures and Requirements table contains only
the most important tests. For the full test schedule refer to
the documents listed above. The testing also covers most of
the requirements specified by EIA/IS-703 and JIS-C-5202.
The tests are carried out in accordance with IEC 60068-2-xx
test method and under standard atmospheric conditions in
accordance with IEC 60068-1, 5.3. Climatic category
-20 °C / +125 °C / 56 days (rated temperature range: Lower
category temperature, upper category temperature; damp
heat, long term, 56 days) is valid.
UXA 0204, UXB 0207, UXE 0414
Vishay Beyschlag
Unless otherwise specified the following values apply:
• Temperature: 15 C to 35 C
• Relative humidity: 45 % to 75 %
• Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
For testing the components are mounted on a test board in
accordance with IEC 60115-1, 4.31 unless otherwise
specified.
In the Test Procedures and Requirements table only the
tests and requirements are listed with reference to the
relevant clauses of IEC 60115-1 and IEC 60068-2-xx test
method. A short description of the test procedure is also
given.
TEST PROCEDURES AND REQUIREMENTS
PROCEDURE
Stability for product types:
IEC
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
UXA 0204
UXB 0207
4.5
-
Resistance
UXE 0414
-
REQUIREMENTS PERMISSIBLE CHANGE (R)
100 to 100 k
100 to 250 k
100 to 100 k
22 to < 100
> 100 k to 221 k
40.2 to < 100
> 250 k to 301 k
22 to < 100
> 100 k to 511 k
-
10 to < 40.2
> 301 k to 1 M
-
± 0.25 %; ± 0.1 %; ± 0.05 %; ± 0.01 %
4.7
-
Voltage proof
URMS = Uins; 60 s
At (20 / -20 / 20) °C and
4.8
-
Temperature
coefficient
(20 / 85 / 20) °C
At (20 / 0 / 20) °C and
(20 / 60 / 20) °C
No flashover or breakdown
10 ppm/K; 5 ppm/K
2 ppm/K
4.13
-
Short time
overload
Room temperature;
U = 2.5 x P70 x R or
U = 2 x Umax.; 5 s
± (0.01 % R + 0.01 ) ± (0.01 % R + 0.01 ) ± (0.02 % R + 0.01 )
4.16
21 (Ua1)
21 (Ub)
21 (Uc)
Robustness
of terminations
Tensile, bending,
and torsion
± (0.01 % R + 0.01 ) ± (0.01 % R + 0.01 ) ± (0.02 % R + 0.01 )
at +235 °C; 2 s;
solder bath method;
SnPb40
4.17
20 (Ta) Solderability
at +245 °C; 3 s;
solder bath method;
SnAg3Cu0.5
Good tinning (> 95 % covered); no damage
4.18.2
20 (Tb)
Resistance to
soldering heat
Unmounted components;
(260 ± 5) °C; (10 ± 1) s
± (0.01 % R + 0.01 ) ± (0.01 % R + 0.01 ) ± (0.02 % R + 0.01 )
4.19
14 (Na)
Rapid change
of temperature
30 min at -55 °C
30 min at +125 °C
5 cycles
± (0.01 % R + 0.01 ) ± (0.01 % R + 0.01 ) ± (0.02 % R + 0.01 )
10 sweep cycles per
4.22
6 (B4)
Vibration
direction; 10 Hz to 2000 Hz ± (0.01 % R + 0.01 ) ± (0.01 % R + 0.01 ) ± (0.02 % R + 0.01 )
1.5 mm or 200 m/s2
Revision: 07-Mar-16
6
Document Number: 28726
For technical questions, contact: filmresistorsleaded@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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