LTC4440AH-5 データシートの表示（PDF） - Linear Technology

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LTC4440AH-5

High Speed, High Voltage, High Side Gate Driver

Linear Technology 

Package Description

MS8E Package

8-Lead Plastic MSOP, Exposed Die Pad

(Reference LTC DWG # 05-08-1662 Rev J)

LTC4440A-5

BOTTOM VIEW OF

EXPOSED PAD OPTION

1.88

1

(.074)

0.29

1.88 ±0.102

(.074 ±.004)

0.889 ±0.127

(.035 ±.005)

1.68

REF

(.066)

5.23

(.206)

MIN

1.68 ±0.102 3.20 – 3.45

(.066 ±.004) (.126 – .136)

0.42 ±0.038

(.0165 ±.0015)

TYP

0.65

(.0256)

BSC

RECOMMENDED SOLDER PAD LAYOUT

3.00 ±0.102

(.118 ±.004)

(NOTE 3)

8

8 7 65

0.05 REF

DETAIL “B”

DETAIL “B”

CORNER TAIL IS PART OF

THE LEADFRAME FEATURE.

FOR REFERENCE ONLY

NO MEASUREMENT PURPOSE

0.52

(.0205)

REF

0.254

(.010)

DETAIL “A”

0° – 6° TYP

4.90 ±0.152

(.193 ±.006)

3.00 ±0.102

(.118 ±.004)

(NOTE 4)

GAUGE PLANE

0.18

(.007)

0.53 ±0.152

(.021 ±.006)

DETAIL “A”

1 234

1.10

(.043)

MAX

SEATING

PLANE 0.22 – 0.38

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

(.009 – .015)

TYP

0.65

(.0256)

BSC

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD

SHALL NOT EXCEED 0.254mm (.010") PER SIDE.

0.86

(.034)

REF

0.1016 ±0.0508

(.004 ±.002)

MSOP (MS8E) 0911 REV J

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconFneocrtimonoorfeitsincfiorcrumitsataisodneswcwribwe.dlihneeraeirn.cwoimll n/oLTt iCnf4ri4n4ge0Aon-5existing patent rights.

4440a5f

11

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