HSD882S データシートの表示（PDF） - Hi-Sincerity Microelectronics
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HSD882S Datasheet PDF : 5 Pages
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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6544
Issued Date : 1992.11.25
Revised Date : 2006.07.28
Page No. : 4/5
TO-92 Dimension
B
C
E
F
α2
A
123
α3
D
H
G
I
α1
Marking:
Pb Free Mark
Pb-Free: " . " (Note)
Normal: None
H SD
8 8 2S
Date Code
Control Code
Note: Green label is used for pb-free packing
Pin Style: 1.Emitter 2.Collector 3.Base
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
3-Lead TO-92 Plastic Package
HSMC Package Code: A
DIM Min. Max.
A
4.33 4.83
B
4.33 4.83
C 12.70
-
D
0.36 0.56
E
-
*1.27
F
3.36 3.76
G
0.36 0.56
H
-
*2.54
I
-
*1.27
α1
-
*5°
α2
-
*2°
α3
-
*2°
*: Typical, Unit: mm
TO-92 Taping Dimension
DIM Min. Max.
H2 H2
H2AH2A
D2
A
4.33 4.83
D
3.80 4.20
D1 0.36 0.53
D2 4.33 4.83
A
F1,F2 2.40 2.90
H3
H 15.50 16.50
H1 8.50 9.50
H2
-
1
H2A
-
1
L
L1
F1F2
T2
P1
T
P
T1
H4 H
H3
-
27
H4
-
21
L
-
11
H1
W1
L1 2.50
-
W
P 12.50 12.90
P1 5.95 6.75
D1
D
P2 50.30 51.30
T
-
0.55
T1
-
1.42
T2 0.36 0.68
P2
W 17.50 19.00
W1 5.00 7.00
Unit: mm
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSD882S
HSMC Product Specification
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