A64E06161(2004) データシートの表示（PDF） - AMIC Technology
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A64E06161 Datasheet PDF : 20 Pages
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Deep Power Down Specifications and Conditions
Symbol
IZZ
Description
Deep Power-Down
Conditions
VIN = VCCQ or 0V; +25°C
ZZ = LOW
CR[4] = 0
Typ.
A64E06161
Max.
10
Units
µA
Partial Array Refresh Specifications Conditions
Symbol
Description
Conditions
IPAR
Partial Array Refresh
Current
VIN = VCCQ or 0V
ZZ = LOW
CR[4] = 1
Note: IPAR (MAX) values measured with TCR set to 85°C
Density
Array
Partition
12Mb
3/4
8Mb
1/2
4Mb
1/4
Typ. Max.
90
80
70
Units
µA
µA
µA
Temperature Compensated Refresh Specifications Conditions
Symbol
ITCR
Description
Temperature
Compensated Refresh
Standby Current
Conditions
VIN = VCCQ or 0V
Chip Disabled
Density
16Mb
Max Case
Temperatures
+85°C
+70°C
+45°C
+15°C
Note: 1. ITCR (MAX) values measured with FULL ARRAY refresh.
2. This device assumes a standby mode if the chip is disabled ( CE HIGH).
Typ.
Max.
100
90
80
70
Units
µA
µA
µA
µA
Truth Table
CE
ZZ
OE
WE
LB
HB I/O0 to I/O7 Mode I/O8 to I/O15 Mode
VCC Current
H
H
X
X
X
X
Not selected
H
L
X
X
X
X
Not selected
H
L
X
X
X
X
Not selected
Not selected
Not selected
Not selected
ISB1
IZZ*2
IPAR*2
L
L
X
L
X
X
Not selected
Not selected
L
L
Read
Read
L
H
L
H
L
H
Read
High - Z
H
L
High - Z
Read
L
L
Write
Write
L
H
X
L
L
H
Write
Not Write/Hi - Z
H
L
Not Write/Hi - Z
Write
L
H
H
H
X
X
High - Z
High - Z
Note: 1. X = H or L
2. DPD is enable when CR register A4 is “0”; otherwise, PAR is enable
Load CR Register
ICC1, ICC2
ICC1, ICC2
ICC1, ICC2
ICC1, ICC2
ICC1, ICC2
ICC1, ICC2
ICC1, ICC2
PRELIMINARY (November, 2004, Version 0.1)
4
AMIC Technology, Corp.
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