ADG1408YRUZ データシートの表示（PDF） - Analog Devices
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ADG1408YRUZ Datasheet PDF : 19 Pages
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ADG1408/ADG1409
Data Sheet
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
A0 1
EN 2
VSS 3
S1 4
S2 5
S3 6
S4 7
D8
16 A1
15 A2
ADG1408
TOP VIEW
(Not to Scale)
14 GND
13 VDD
12 S5
11 S6
10 S7
9 S8
Figure 2. ADG1408 Pin Configuration (TSSOP)
VSS 1
S1 2
S2 3
S3 4
ADG1408
TOP VIEW
(Not to Scale)
12 GND
11 VDD
10 S5
9 S6
NOTES
1. THE EXPOSED PAD IS
CONNECTED INTERNALLY. FOR
INCREASED RELIABILITY OF THE
SOLDER JOINTS AND MAXIMUM
THERMAL CAPABILITY, IT IS
RECOMMENDED THAT THE PAD BE
SOLDERED TO THE SUBSTRATE, VSS.
Figure 3. ADG1408 Pin Configuration (LFCSP)
Table 8. ADG1408 Pin Function Descriptions
Pin No.
TSSOP
LFCSP Mnemonic Description
1
15
A0
Logic Control Input.
2
16
EN
Active High Digital Input. When low, the device is disabled and all switches are off. When high,
Ax logic inputs determine on switches.
3
1
VSS
Most Negative Power Supply Potential. In single supply applications, it can be connected to ground.
4
2
S1
Source Terminal 1. Can be an input or an output.
5
3
S2
Source Terminal 2. Can be an input or an output.
6
4
S3
Source Terminal 3. Can be an input or an output.
7
5
S4
Source Terminal 4. Can be an input or an output.
8
6
D
Drain Terminal. Can be an input or an output.
9
7
S8
Source Terminal 8. Can be an input or an output.
10
8
S7
Source Terminal 7. Can be an input or an output.
11
9
S6
Source Terminal 6. Can be an input or an output.
12
10
S5
Source Terminal 5. Can be an input or an output.
13
11
VDD
Most Positive Power Supply Potential.
14
12
GND
Ground (0 V) Reference.
15
13
A2
Logic Control Input.
16
14
A1
Logic Control Input.
Not
0
applicable
EPAD
Exposed Pad. The exposed pad is connected internally. For increased reliability of the solder joints and
maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 9. ADG1408 Truth Table
A2
A1
A0
EN
On Switch
X
X
X
0
None
0
0
0
1
1
0
0
1
1
2
0
1
0
1
3
0
1
1
1
4
1
0
0
1
5
1
0
1
1
6
1
1
0
1
7
1
1
1
1
8
Rev. D | Page 10 of 19
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