ADG1409YRUZ-REEL7 データシートの表示（PDF） - Analog Devices
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ADG1409YRUZ-REEL7 Datasheet PDF : 19 Pages
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Data Sheet
ADG1408/ADG1409
A0 1
EN 2
VSS 3
S1A 4
S2A 5
S3A 6
S4A 7
DA 8
16 A1
15 GND
ADG1409
TOP VIEW
(Not to Scale)
14 VDD
13 S1B
12 S2B
11 S3B
10 S4B
9 DB
VSS 1
S1A 2
S2A 3
S3A 4
ADG1409
TOP VIEW
(Not to Scale)
12 VDD
11 S1B
10 S2B
9 S3B
Figure 4. ADG1409 Pin Configuration (TSSOP)
NOTES
1. THE EXPOSED PAD IS
CONNECTED INTERNALLY. FOR
INCREASED RELIABILITY OF THE
SOLDER JOINTS AND MAXIMUM
THERMAL CAPABILITY, IT IS
RECOMMENDED THAT THE PAD BE
SOLDERED TO THE SUBSTRATE, VSS.
Figure 5. ADG1409 Pin Configuration (LFCSP)
Table 10. ADG1409 Pin Function Descriptions
Pin No.
TSSOP LFCSP Mnemonic Description
1
15
A0
Logic Control Input.
2
16
EN
Active High Digital Input. When low, the device is disabled and all switches are off. When high,
Ax logic inputs determine on switches.
3
1
VSS
Most Negative Power Supply Potential. In single supply applications, it can be connected to ground.
4
2
S1A
Source Terminal 1A. Can be an input or an output.
5
3
S2A
Source Terminal 2A. Can be an input or an output.
6
4
S3A
Source Terminal 3A. Can be an input or an output.
7
5
S4A
Source Terminal 4A. Can be an input or an output.
8
6
DA
Drain Terminal A. Can be an input or an output.
9
7
DB
Drain Terminal B. Can be an input or an output.
10
8
S4B
Source Terminal 4B. Can be an input or an output.
11
9
S3B
Source Terminal 3B. Can be an input or an output.
12
10
S2B
Source Terminal 2B. Can be an input or an output.
13
11
S1B
Source Terminal 1B. Can be an input or an output.
14
12
VDD
Most Positive Power Supply Potential.
15
13
GND
Ground (0 V) Reference.
16
14
A1
Logic Control Input.
Not
0
applicable
EPAD
Exposed Pad. The exposed pad is connected internally. For increased reliability of the solder joints
and maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 11. ADG1409 Truth Table
A1
A0
EN
X
X
0
0
0
1
0
1
1
1
0
1
1
1
1
On Switch Pair
None
1
2
3
4
Rev. D | Page 11 of 19
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