ADP3208C データシートの表示（PDF） - ON Semiconductor
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ADP3208C Datasheet PDF : 37 Pages
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ADP3208C
GND VCC EN RPM RT RAMP VARFREQ SP
COMP
FB
LLINE
PSI
UVLO
Shutdown
and Bias
+Σ
REF +
VEA
−
+
CSREF
+Σ _
1.7V
Oscillator
Current
Balancing
Circuit
OVP
TTSNS
VRTT
Thermal
Throttle
Control
Driver
Logic
DAC − 200mV
−
CSREF
+
−
+
DAC − 300mV
PWRGD
PWRGD
Open
Drain
CLKEN
FBRTN
CLKEN
Open
Drain
Precision
Reference
OCP
Shutdown
Delay
PWRGD
Startup
Delay
CLKEN
Startup
Delay
Current
Limit
Circuit
Soft
Transient
Delay
Delay
Disable
VID
DAC
DAC
REF
DPRSTP
DPRSLP
Logic
Current
Monitor
+
−
Soft−Start
Soft Transient
BST1
DRVH1
SW1
PVCC1
DRVL1
PGND1
BST2
DRVH2
SW2
PVCC2
DRVL2
PGND2
DPRSTP
DPRSLP
IMON
CSREF
CSSUM
CSCOMP
ILIMN
ILIMP
Figure 1. Functional Block Diagram
ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Unit
VCC, PVCC1, PVCC2
FBRTN, PGND1, PGND2
BST1, BST2
DC
t < 200 ns
−0.3 to +6.0
V
−0.3 to +0.3
V
V
−0.3 to +28
−0.3 to +33
BST1 to SW1, BST2 to SW2
SW1, SW2
DC
t < 200 ns
−0.3 to +6.0
V
V
−5.0 to +22
−10 to +28
DRVH1 to SW1, DRVH2 to SW2
DRVL1 to PGND1, DRVL2 to PGND2
DC
t < 200 ns
−0.3 to +6.0
V
V
−0.3 to +6.0
−5.0 to +6.0
RAMP (In Shutdown) DC
−0.3 to +22
V
All Other Inputs and Outputs
−0.3 to +6.0
V
Storage Temperature
−65 to +150
°C
Operating Ambient Temperature Range
−10 to 100
°C
Operating Junction Temperature
125
°C
Thermal Impedance (qJA) 2−Layer Board
Lead Temperature
Soldering (10 sec)
Infrared (15 sec)
40
°C/W
°C
300
260
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.
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