AS1109-BSST(2009) データシートの表示（PDF） - austriamicrosystems AG

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AS1109-BSST
(Rev.:2009)

Constant-Current, 8-Bit LED Driver with Diagnostics

austriamicrosystems AG 

AS1109

Data Sheet - Absolute Maximum Ratings

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical

Characteristics on page 5 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

VDD to GND

Input Voltage

0

7

V

-0.4

VDD

+0.4

V

Output Voltage

-0.4

15

V

GND Pin Current

1000

mA

Thermal Resistance ΘJA

Operating Temperature Range

Storage Temperature

Humidity

Electrostatic

Discharge

Digital Outputs

All Other Pins

83

113

32

-40

+85

-55

150

5

86

2000

2000

ºC/W on PCB, 16-pin SOIC-150 package

ºC/W on PCB, 16-pin SSOP-150 package

ºC/W on PCB, 16-pin QFN (4x4mm) package

ºC Device fully functional up to 125°C

ºC

%

Non-condensing

Norm: MIL 833 E method 3015

V

Latch-Up Immunity

-100 -

(INOM x 0.5)

+100 +

INOM

Package Body Temperature

+260

mA

EIA/JESD78

The reflow peak soldering temperature

(body temperature) specified is in

accordance with IPC/JEDEC J-STD-

ºC

020C “Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid

State Surface Mount Devices”.

The lead finish for Pb-free leaded

packages is matte tin (100% Sn).

* Min/max values are load dependent.

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