BAS16 データシートの表示（PDF） - NXP Semiconductors.

部品番号

コンポーネント説明

メーカー

BAS16

High-speed switching diodes

NXP Semiconductors. 

NXP Semiconductors

BAS16 series

High-speed switching diodes

Table 6. Limiting values …continued

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter

Conditions

Min

Per device

Tj

junction temperature

-

Tamb

ambient temperature

−65

Tstg

storage temperature

−65

Max Unit

150

°C

+150 °C

+150 °C

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[2] Device mounted on an FR4 PCB with 60 µm copper strip line.

[3] Single diode loaded.

[4] Tj = 25 °C prior to surge.

[5] Reflow soldering is the only recommended soldering method.

[6] Soldering point of cathode tab.

[7] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

[8] Soldering points at pins 4, 5 and 6.

6. Thermal characteristics

Table 7.

Symbol

Rth(j-a)

Thermal characteristics

Parameter

thermal resistance from

junction to ambient

BAS16

BAS16H

BAS16J

BAS16L

BAS16VV

Conditions

in free air

Rth(j-t)

BAS16W

thermal resistance from

junction to tie-point

BAS16

BAS16W

Min Typ Max Unit

[1] -

-

500 K/W

[2][3] -

-

330 K/W

[3][4] -

-

150 K/W

[3][4] -

-

230 K/W

[2][3] -

-

500 K/W

[2][3] -

-

700 K/W

[5]

[3][4] -

-

410 K/W

[5]

[1] -

-

625 K/W

-

-

330 K/W

-

-

300 K/W

BAS16_SER_5

Product data sheet

Rev. 05 — 25 August 2008

© NXP B.V. 2008. All rights reserved.

5 of 20

Share Link: