NXP Semiconductors
BC848 series
30 V, 100 mA NPN general-purpose transistors
2.65
0.75
1.325
1.30
2.35
0.85
0.60
(3×)
2
3
1
0.50
(3×) 1.90
0.55
(3×)
2.40
msa429
Fig 9. Reflow soldering footprint SOT323 (SC-70)
solder lands
solder paste
solder resist
occupied area
Dimensions in mm
4.60
4.00
1.15
2
3.65 2.10
3
1
2.70
0.90
(2×)
preferred transport direction during soldering
solder lands
solder resist
occupied area
Dimensions in mm
msa419
Fig 10. Wave soldering footprint SOT323 (SC-70)
BC848_SER_7
Product data sheet
Rev. 07 — 17 November 2009
© NXP B.V. 2009. All rights reserved.
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