BF620 データシートの表示（PDF） - NXP Semiconductors.
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BF620 Datasheet PDF : 11 Pages
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NXP Semiconductors
NPN high-voltage transistors
Product data sheet
BF620; BF622
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
PARAMETER
thermal resistance from junction to
ambient
Rth(j-s)
thermal resistance from junction to
soldering point
CONDITIONS
in free air
note 1
note 2
note 3
VALUE
250
156
113
30
UNIT
K/W
K/W
K/W
K/W
Notes
1. Device mounted on a printed-circuit board, single-sided copper, tin-plated and standard footprint.
2. Device mounted on a printed-circuit board, single-sided copper, tin-plated and mounting pad for collector 1 cm2.
3. Device mounted on a printed-circuit board, single-sided copper, tin-plated and mounting pad for collector 6 cm2.
103
Zth
(K/W)
102
(1)
(2)
(3)
(4)
(5)
(6)
(7)
10 (8)
(9)
(10)
006aaa235
1
10−5
10−4
10−3
10−2
10−1
1
10
102
103
tp (s)
Mounted on FR4 printed-circuit board; standard footprint.
(1) δ = 1.
(2) δ = 0.75.
(3) δ = 0.5.
(4) δ = 0.33.
(5) δ = 0.2.
(6) δ = 0.1.
(7) δ = 0.05.
(8) δ = 0.02.
(9) δ = 0.01.
(10) δ = 0.
Fig.3 Transient thermal impedance as a function of pulse time; typical values.
2004 Dec 14
5
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