DALLAS SEMICONDUCTOR
DS21FF42/DS21FT42
17.1 RECEIVE SIDE ................................ ................................ ...............72
17.2 TRANSMIT SIDE................................ ................................ ............73
17.3 MINIMUM DELAY SYNCHRONOUS RSYSCLK/TSYSCLK MODE .....73
18. HDLC CONTROLLER................................ ................................ ......74
18.1 HDLC FOR DS0S................................ ................................ ...............74
19. FDL/FS EXTRACTION AND INSERTION ................................ .........75
19.1 HDLC AND BOC CONTROLLER FOR THE FDL ............................... 75
19.1.1 General Overview ................................ ................................ ........75
19.1.2 Status Register for the HDLC ................................ ......................76
19.1.3 HDLC/BOC Register Description ................................ ..................79
19.2 LEGACY FDL SUPPORT ................................ ................................ .86
19.2.1 Overview ................................ ................................ ....................86
19.2.2 Receive Section ................................ ................................ ...........86
19.2.3 Transmit Section ................................ ................................ ........87
19.3 D4/SLC–96 OPERATION ................................ ................................ .88
20. PROGRAMMABLE IN–BAND CODE GENERATION AND DETECTION
89
21. TRANSMIT TRANSPARENCY ................................ ..........................93
22. INTERLEAVED PCM BUS OPERATION ................................ ..........94
23. JTAG-BOUNDARY SCAN ARCHITECTURE AND TEST ACCESS PORT
97
23.1 DESCRIPTION................................ ................................ ....................97
23.2 TAP CONTROLLER STATE MACHINE ................................ ....................98
23.3 INSTRUCTION REGISTER AND INSTRUCTIONS................................ ......... 101
23.4 TEST REGISTERS ................................ ................................ ............. 104
24. TIMING DIAGRAMS ................................ ................................ ...... 109
25. OPERATING PARAME TERS ................................ .......................... 124
26. MCM PACKAGE DIME NSIONS ................................ ...................... 144
DOCUMENT REVISION HISTORY
Revision
Notes
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