5962-8957101PA データシートの表示（PDF） - Avago Technologies

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コンポーネント説明

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5962-8957101PA

Hermetically Sealed, Very High Speed, Logic Gate Optocouplers

Avago Technologies 

Functional Diagrams

8 Pin DIP

Through Hole

1 Channel

8 Pin DIP

Through Hole

2 Channels

20 Pad LCCC

Surface Mount

2 Channels

1

VCC 8

2

VE 7

3

6

VO

4

GND 5

1

VCC 8

VO1

2

7

VO2

3

6

4

GND 5

15

VCC2

19

VO2

13

20

GND2 12

2

VO1 VCC1 10

3

GND1

78

Note:

All DIP devices have common VCC and ground. LCCC (leadless ceramic chip carrier) package has isolated channels with separate VCC and ground

connections.

Outline Drawings

20 Terminal LCCC Surface Mount, 2 Channels

1.78 (0.070)

2.03 (0.080)

8.70 (0.342)

9.10 (0.358)

4.95 (0.195)

5.21 (0.205)

1.78 (0.070)

2.03 (0.080)

1.52 (0.060)

2.03 (0.080)

8.70 (0.342)

9.10 (0.358)

4.95 (0.195)

5.21 (0.205)

0.64

(0.025)

(20 PLCS)

1.02 (0.040) (3 PLCS)

1.14 (0.045)

1.40 (0.055)

TERMINAL 1 IDENTIFIER

2.16 (0.085)

METALLIZED

CASTILLATIONS (20 PLCS)

0.51 (0.020)

Note: Dimensions in millimeters (inches).

Solder thickness 0.127 (0.005) max.

8 Pin DIP Through Hole, 1 and 2 Channel

9.40 (0.370)

9.91 (0.390)

0.76 (0.030)

1.27 (0.050)

4.32 (0.170)

MAX.

0.51 (0.020)

MIN.

3.81 (0.150)

MIN.

2.29 (0.090)

2.79 (0.110)

3

0.51 (0.020)

MAX.

Note: Dimensions in millimeters (inches).

8.13 (0.320)

MAX.

7.16 (0.282)

7.57 (0.298)

0.20 (0.008)

0.33 (0.013)

7.36 (0.290)

7.87 (0.310)

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