HSMD-C265(2007) データシートの表示（PDF） - Avago Technologies

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HSMD-C265
(Rev.:2007)

Surface Mount Chip LEDs

Avago Technologies 

4.00 (0.157)

DIM. A

(SEE TABLE 1)

DIM. B

(SEE TABLE 1)

2.00 ± 0.05

(0.079 ± 0.002)

4.00 (0.157)

1.50 (0.059)

CATHODE

DIM. C

(SEE TABLE 1)

1.75 (0.069)

0.20 ± 0.05

(0.008 ± 0.002)

3.50 ± 0.05

(0.138 ± 0.002)

8.00 ± 0.30

(0.315 ± 0.012)

USER FEED

DIRECTION

CARRIER TAPE

COVER TAPE

TABLE 1

DIMENSIONS IN MILLIMETERS (INCHES)

DIM. A

DIM. B

DIM. C

PART NUMBER ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004)

HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057) 1.30 (0.051)

Figure 10. Tape dimensions.

HSMx-C260 fig 10

END

START

Convective IR Reflow Soldering

For more information on IR reflow

soldering, refer to

Applica-

tion Note 1060, Surface Mounting

SMT LED Indicator Components.

THERE SHALL BE A

MINIMUM OF 160 mm

(6.3 INCH) OF EMPTY

COMPONENT POCKETS

SEALED WITH COVER

TAPE.

MOUNTED WITH

COMPONENTS

THERE SHALL BE A

MINIMUM OF 160 mm

(6.3 INCH) OF EMPTY

COMPONENT POCKETS

SEALED WITH COVER

TAPE.

MINIMUM OF

230 mm

(9.05 INCH)

MAY CONSIST

OF CARRIER

AND/OR

COVER TAPE.

Figure 11. Tape leader and trailer dimensions.

HSMx-C260 fig 11

Notes:

1. All dimensions in millimeters (inches).

2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.

Storage Condition: 5 to 30˚C at 60% RH max.

Baking is required under the condition:

a) the blue silica gell indicator becoming white/transpar-

ent color

b) the pack has been open for more than 1 week

Baking recommended condition: 60 ± 5˚C for 20 hours.

6

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