HSMX-C265(2002) データシートの表示（PDF） - HP => Agilent Technologies

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コンポーネント説明

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HSMX-C265
(Rev.:2002)

Surface Mount Chip LEDs

HP => Agilent Technologies 

Package Dimensions

3.4 (0.134)

LED DIE

CATHODE

MARK (ETCHED)

[ANODE MARK FOR HSMH-C265]

1.25 (0.049)

2 – 0.6 (0.028)

(GREEN SOLDER MASK)

UNDIFFUSED

EPOXY

1.1 (0.043)

PC BOARD

1.2

(0.047)

CATHODE LINE

0.50 ± 0.15

(0.020 ± 0.006)

POLARITY[3]

1.1 (0.043)

0.3 (0.012)

0.50 ± 0.15

(0.020 ± 0.006)

SOLDERING

TERMINAL

NOTES:

1. ALL DIMENSIONS IN MILLIMETERS (INCHES).

2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.

3. POLARITY OF HSMH-C265 WILL BE THE OPPOSITE OF WHAT IS SHOWN

ON ABOVE DRAWING.

Absolute Maximum Ratings

TA = 25°C

Parameter

DC Forward Current [1]

Peak Pulsing Current[2]

Power Dissipation

Reverse Voltage (IR = 100 µA)

LED Junction Temperature

Operating Temperature Range

Storage Temperature Range

Soldering Temperature

HSMD/G/S/Y-C265

HSMH-C265

25

25

100

100

65

65

5

5

95

95

–30 to +85

–30 to +85

–40 to +85

–40 to +85

See IR soldering profile (Figure 6)

Notes:

1. Derate linearly as shown in Figure 4.

2. Pulse condition of 1/10 duty and 0.1 ms width.

2

Units

mA

mA

mW

V

°C

°C

°C

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