HSMX-C265(2002) データシートの表示（PDF） - HP => Agilent Technologies

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HSMX-C265
(Rev.:2002)

Surface Mount Chip LEDs

HP => Agilent Technologies 

4.00 (0.157)

DIM. A

(SEE TABLE 1)

DIM. B

(SEE TABLE 1)

2.00 ± 0.05

(0.079 ± 0.002)

4.00 (0.157)

1.50 (0.059)

CATHODE

DIM. C

(SEE TABLE 1)

1.75 (0.069)

0.20 ± 0.05

(0.008 ± 0.002)

3.50 ± 0.05

(0.138 ± 0.002)

8.00 ± 0.30

(0.315 ± 0.012)

USER FEED

DIRECTION

CARRIER TAPE

COVER TAPE

TABLE 1

DIMENSIONS IN MILLIMETERS (INCHES)

DIM. A

DIM. B

DIM. C

PART NUMBER ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004)

HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057) 1.30 (0.051)

Figure 10. Tape dimensions.

END

START

THERE SHALL BE A

MINIMUM OF 160 mm

(6.3 INCH) OF EMPTY

COMPONENT POCKETS

SEALED WITH COVER

TAPE.

MOUNTED WITH

COMPONENTS

THERE SHALL BE A

MINIMUM OF 160 mm

(6.3 INCH) OF EMPTY

COMPONENT POCKETS

SEALED WITH COVER

TAPE.

MINIMUM OF

230 mm

(9.05 INCH)

MAY CONSIST

OF CARRIER

AND/OR

COVER TAPE.

Figure 11. Tape leader and trailer dimensions.

Convective IR Reflow Soldering

For more information on IR

reflow soldering, refer to

Application Note 1060, Surface

Mounting SMT LED Indicator

Components.

Storage Condition:

5 to 30°C @ 60% RH max.

Baking is required under the

condition:

a) the blue silica gel indicator

becoming white/transparent

color

b) the pack has been open for

more than 1 week

Baking recommended condition:

60 ± 5°C for 20 hours.

Notes:

1. All dimensions in millimeters (inches).

2. Tolerance is 0.1 mm (0.004 in.) unless otherwise specified.

7

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