NE76118 データシートの表示（PDF） - NEC => Renesas Technology
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NE76118 Datasheet PDF : 8 Pages
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NE76118
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales offices in case other soldering process is used, or in case soldering is done under
different conditions.
<TYPES OF SURFACE MOUNT DEVICE>
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E).
Soldering process
VPS
Wave soldering
Infrared ray reflow
Partial heating method
Soldering conditions
Package peak temperature : 215 °C, Time : 40 seconds MAX.
(200 °C MIN.), Number of times : 2, Number of days : not limited*
Soldering bath temperature : 260 °C MAX., Time : 10 seconds MAX.,
Number of times : 1, Number of days : not limited*
Peak package’s surface temperature: 230 °C or below,
Reflow time: 30 seconds or below (210 °C or higher),
Number of reflow process: 2, Exposure limit*: None
Terminal temperature: 230 °C or below,
Flow time: 10 seconds or below,
Exposure limit*: None
Symbol
VP15-00-2
WS60-00-1
IR30-00-2
* Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25 °C and relative humidity at 65 % or less.
Note Do not apply more than a single process at once, except for “Partial heating method”.
PRECAUTION Avoid high static voltage and electric fields, because this device is MES FET with GaAs
shottky barrier gate.
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