RF2314 データシートの表示（PDF） - RF Micro Devices

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RF2314

GENERAL PURPOSE LOW NOISE AMPLIFIER

RF Micro Devices 

RF2314

Thermal Pad and Via Design

The PCB land pattern has been designed with a thermal pad that matches the exposed die paddle size on the bottom of

the device.

Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern shown

has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommo-

dating routing strategies.

The via pattern used for the RFMD qualification is based on thru-hole vias between 0.203mm to 0.330mm finished hole

size with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be

increased by a 4:1 ratio to achieve similar results.

Via

0.203 - 0.330 (mm)

Finished Hole

Figure 3. Thermal Pad and Via Design (RFMD qualification)

4-220

Rev A6 051025

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