PACKAGE DESCRIPTIO
LTC3400/LTC3400B
S6 Package
6-Lead Plastic SOT-23
(Reference LTC DWG # 05-08-1636)
0.754
0.854 ± 0.127
2.90 BSC
(NOTE 4)
3.254
0.95 BSC
2.80 BSC 1.50 – 1.75
(NOTE 4)
PIN ONE ID
1.9 BSC
RECOMMENDED SOLDER PAD LAYOUT
0.20 BSC
DATUM ‘A’
0.95 BSC
0.80 – 0.90
1.00 MAX
0.30 – 0.50 REF
0.09 – 0.20
NOTE:
(NOTE 3)
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
1.90 BSC
0.30 – 0.45 TYP
6 PLCS (NOTE 3)
0.01 – 0.10
S6 TSOT-23 0801
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3400f
11