NIS3001 データシートの表示（PDF） - ON Semiconductor
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NIS3001 Datasheet PDF : 18 Pages
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NIS3001
MAXIMUM RATINGS*
Rating
Operating Junction Temperature, TJ
Output DC Current
Package Thermal Resistance:
Junction to Ambient, RqJ−A (4 layer PCB with vias, no air flow)
Junction to Ambient, RqJ−A (4 layer PCB with vias, 200lfm air flow)
Junction to PCB, RqJ−PCB (4 layer PCB with vias)
Storage Temperature Range, TS
ESD Susceptibility (Human Body Model)
Lead Temperature Soldering:
Reflow: (SMD styles only) (Note 1)
JEDEC Moisture Sensitivity Level
Pin Symbol
VS
Pin Name
Driver Supply Voltage
MAX
6.3 V
MIN
−0.3 V
ISOURCE
NA
BST
DRN
TG
BG
CO
EN
PGND
Bootstrap Supply Voltage 25 V wrt/PGND
Input
6.3 V wrt/DRN
Switching Node
(Bootstrap Supply Return)
25 V
High Side Driver Output
(Top Gate)
Low Side Driver Output
(Bottom Gate)
TG & BG Control Input
Enable Input
Ground
25 V wrt/PGND
6.3 V wrt/DRN
6.3 V
6.3 V
6.3 V
0V
−0.3 V wrt/DRN
−1.0 V DC
−5.0 V for 20 ns
−6.0 V for 20 ns
−0.3 V wrt/DRN
−0.3 V
−0.3 V
−0.3 V
0V
VIN
Input Supply Voltage
14 V
−
NOTE: All voltages are with respect to PGND except where noted.
1. 60 seconds maximum above 183°C.
*The maximum package power dissipation must be observed.
NA
4.0 A Peak (< 100 ms)
250 mA DC
4.0 A Peak (< 100 ms)
250 mA DC
4.0 A Peak (< 100 ms)
250 mA DC
1.0 mA
1.0 mA
4.0 A Peak (< 100 ms)
250 mA DC
−
Value
Unit
125
°C
25
A
°C/W
26
13
8.0
−65 to 150
°C
500
V
230 peak
°C
3
MSL
ISINK
4.0 A Peak (< 100 ms)
250 mA DC
4.0 A Peak (< 100 ms)
250 mA DC
NA
4.0 A Peak (< 100 ms)
250 mA DC
4.0 A Peak (< 100 ms)
250 mA DC
1.0 mA
1.0 mA
NA
−
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