NJL5192K データシートの表示（PDF） - Japan Radio Corporation
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NJL5192K Datasheet PDF : 8 Pages
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PRECAUTION FOR HANDLING
NJL5190K/92K
1. Soldering
1) Avoid the reflow method and solder to touch the body of the device during wave soldering. This is to prevent
changes in optical characteristics of the device.
2) Recommended in Soldering
Temperature
Time Lead
Soldering Position
260°C maximum less than 10 seconds
At least 1.5mm from body
3) Soldering is recommended to be done in as short period of the time as possible by controlling the
temperature of the soldering iron or by the iron of less than 15 watts.
4) The resin gets softened right after soldered, so, the following care has to be taken.
- Not to contact the lens surface to anything
- Not to dip the device into water or any solvents
5) It is recommended not to solder when the leads or between the lead get pulled, depressed or twisted.
6) In the case of using rosin flux, be careful to avoid contact with the lens surface. If the lens is covered with
the flux, the specified characteristics cannot be achieved.
2. Post Solder Cleaning
1) Organic solvents for flux removal like trichloroethlene, acetone, thinner etc, might attach the lens surface.
It is preferable to use less reactive solvents, Methyl Alcohol, Isopropyle Alcohol.
2) Cleaning Operation
Cleaning Solvent Temperature : 35°C maximum
Dipping Time
: 3 minute maximum
3. Attention in handling
1) Treat not to touch the lens surface.
2) Avoid dust and any other foreign materials(flux, paints, bonding material, etc.) on the lens surface.
3) Never to apply reverse voltage(VEC) of more than 6V on the photo transistor when measuring the
characteristics or adjusting the system. If applied, it causes to lower the sensitivity.
4) When mounting, special care has to be taken on the mounting position and tilting of the device because it is
very important to place the device to the optimum position to the object.
4. Storage
The leads are silver plated and they are discolored if the device is left open to the air for long after taken out
of the envelop. It causes deterioration of soldering characteristics. Mount the device as short as possible after
opening the envelope.
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