JPAD データシートの表示（PDF） - Linear Technology

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JPAD

PICO AMPERE DIODES

Linear Technology 

Plastic Package Facts:

z Plating Material: Plastic Packages- Matte 100% Tin

z Material of Lead Frame: Copper 194, or Alloy 42

z Lead Content of the Plating Material: Lead Free (Less than 0.1%, 1000ppm

by weight)

z Soldering: Maximum Temperature=260 Degree C, Maximum Time=20-40

seconds

z Reflow Profile: Peak Temperature=260 Degree C, Peak Time=20-40

seconds

z Acceptable number of Reflows: 3 times

z Backward Compatibility: Lead Free packages can be soldered using

existing Sn-Pb solder and temperature profiles

z Forward Compatibility: Lead Free Packages can be soldered using lead free

solders and the appropriate higher temperature profiles

z Storage Conditions: Jedec Std. 20, Level 1

Questions:

Q1: When does LIS plan to offer Lead Free packaging to its customers?

A1: LIS has begun offering customers Lead Free packaging for plastic packages

as of 1/1/04, per customer request.

Q2: When does LIS plan to offer RoHS compliant packaging to its customers?

A2: LIS has begun offering customers RoHS compliant packaging for it plastic

packages as of 1/1/05, per customer request.

Q3: Will LIS continue to offer Non-Lead Free (contains lead) packaging to its

customers?

A3: Yes, LIS will continue to offer Non-Lead Free packaging, per customer

request.

Q4: How do I order Lead Free parts versus Non-Lead Free Parts?

A4: When ordering, specify "Lead-Free" in your part description on Purchase

Orders and Quotations.

Q5: How do I order RoHS Compliant Parts versus Non-RoHS Compliant Parts?

A5: When ordering, specify "RoHS Compliant" in your part description on

Purchase Orders and Quotations.

Q6: How will I be able to identify a Lead-Free / RoHS Compliant Part versus a

Non-Lead Free Part / Non RoHS Compliant Part?

A6: The Lead-Free RoHS Compliant Part will be marked with the letter "F".

Q7: Are there any additional costs for ordering Lead-Free or RoHS Compliant

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